OCP Global Summit - All Keynotes

Welcome to the 2023 OCP Global Summit By George Tchaparian, CEO - OCP By Cliff Grossner, Ph. D., Chief Innovation Officer - OCP By Zaid Kahn, VP, Cloud AI & Advanced Systems Engineering - Microsoft From Edge to Cloud: System Design in the Era of AI - presented by Intel By Zane Ball | Corporate Vice President - General Manager - Data Center Platform Engineering & Architecture - Intel Corporation Unleashing the Power of Collaboration: Overcoming Memory Challenges in the AI/ML Era - presented by Samsung By JongGyu Park, CVP - Samsung By Vincent Kim, Head of DSRA-AVP - Samsung AI Drives Need for (more) Speed - presented by Marvell By Loi Nguyen, EVP, Optical - Marvell Together We Advance the Modern Data Center - presented by AMD By Forrest Norrod, Executive Vice President and General Manager, Data Center Solutions Business Group - AMD Ethernet - The Path to Singularity - presented by Broadcom By Ram Velaga, SVP & GM, Core Switching Group - Broadcom Igniting Change for the Future of Data Center Cooling By Rolf Brink, CEO - Promersion Sustainable Secure Societal Infrastructure for the AI-driven Future - presented by Google By Partha Ranganathan, VP and Engineering Fellow - Google The Changing Landscape of AI in the Data Center - presented by Microsoft By Reynold D'Sa, CVP, Silicon, Cloud Hardware, and Infrastructure Engineering - Microsof Open Infrastructure Platforms to usher in age of GenAI - presented by Meta By Dan Rabinovitsj, VP, Data Center Infrastructure - Meta Closing Remarks By Kali Burdette, Director of Global Events - OCP