AI 전쟁은 모델을 넘어섰다 | 칩·전력·추론·피지컬 AI의 다음 병목 [Asia2G Capital BeyondAsiaTechSummit 참관기]

The AI ​​industry can no longer be explained solely by model performance. Based on the A2G Capital Summit held in Silicon Valley, this video examines where the bottlenecks of the AI ​​industry are shifting. The AI ​​infrastructure war, which began with the competition to secure GPUs, is expanding into issues related to HBM, advanced packaging, power, and data centers. As LLM inference costs rise, cost per token and power efficiency are also becoming critical competitive factors. Internally, beyond simple AI adoption, document structuring, business process redesign, and the evaluation of AI-native talent are emerging as new challenges. Furthermore, AI is expanding beyond chatbots into physical AI domains such as virtual worlds, autonomous drones, defense, and power grid management. This summit also served as a platform demonstrating how Korean and Asian tech startups can resolve bottlenecks within the global AI flywheel. The next competition in AI is not about a single smarter model, but a battle of system design that connects chips, power, data, people, and the real world. We have summarized the next changes in the AI ​​industry observed at the Silicon Valley Korean VC Summit. #AI #SiliconValley #GPU Written by Error Edited by Jin-i Lee [email protected]