Advancing Scalable Photonic Integration with Heterogenous Integration - Optica Industry Webinar

Unlock the potential of scalable photonic circuits. In this Optica webinar, Michael Geiselmann demonstrates how LIGENTEC is revolutionizing heterogenous integration to combine diverse materials with active components for next-gen performance. Key Takeaways: Scalability: Breakthroughs in wafer-scale integration. Performance: Integrating high-speed modulators & photodetectors into standard PIC platforms. Applications: Advancements in computing, sensing, and quantum tech. Speaker: Michael Geiselmann | Moderator: Jon Pugh Contact us: [email protected] #Photonics #PhotonicIntegratedCircuits #Optica

Integrating Active Components in Low-Loss Photonic Integrated Circuits (PICs)
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Integrating Active Components in Low-Loss Photonic Integrated Circuits (PICs)

Microsoft in the race to build the ultimate supercomputer | BBC News | BBC News
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Microsoft in the race to build the ultimate supercomputer | BBC News | BBC News

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Carl Zeiss, Explained: Germany’s Semiconductor Optics Master

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The $200M Machine that Prints Microchips: The EUV Photolithography System

Heterogeneous Integration on Silicon Nitride PICs | Integrated Photonics Summit 2026
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Heterogeneous Integration on Silicon Nitride PICs | Integrated Photonics Summit 2026

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This Battery Lasts for 30 Years And China Just Put It on the Grid

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This Chart Terrifies Electrical Engineers

The World's Most Important Machine
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The World's Most Important Machine

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Turing Award Winner: Disagreeing with Google, Postgres, Future Problems | Mike Stonebraker

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You’ll stop using ChatGPT after listening to this | Jonathan Pageau [ARC 2026]

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The scientific advances ready to change the world: the Top 10 Emerging Technologies 2026

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Why AI Tokens are so Expensive - Computerphile

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The Race to Harness Quantum Computing's Mind-Bending Power | The Future With Hannah Fry

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Anthropic, OpenAI Should Not Be Allowed to IPO, Says Ed Zitron

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Keynote: After the AI Hype – What’s Real, and What’s Next - Richard Campbell - 2026

2.5D Heterogeneous Integration for Silicon Photonics Optical Engines
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2.5D Heterogeneous Integration for Silicon Photonics Optical Engines

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The History of the Semiconductor Photomask

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Andrej Karpathy: From Vibe Coding to Agentic Engineering w/ Stephanie Zhan

Atomic resolution interferometric surface roughness metrology in the dining room
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Atomic resolution interferometric surface roughness metrology in the dining room

Low loss PICs: From fast prototyping to high volumes
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Low loss PICs: From fast prototyping to high volumes