Heterogeneous Integration on Silicon Nitride PICs | Integrated Photonics Summit 2026

In this session from the 2026 Integrated Photonics Summit, Michael Geiselmann,CCO at LIGENTEC, breaks down how heterogeneous integration on a low-loss silicon nitride (SiN) platform is closing the gap between photonic performance and industrial viability. The talk centers on thin-film lithium niobate (TFLN) integration, which brings high-speed modulation to a SiN platform already known for its ultra-low losses — down to 0.2 dB/m, with fiber-to-chip coupling below 1 dB. Michael walks through how this hybrid approach enables RF modulation beyond 110 GHz with a V-pi around 2 volts, how micro-transfer printing brings photodetectors and gain elements onto the same chip, and how LIGENTEC's partnership with X-FAB supports volume manufacturing on a 200mm CMOS line. Hosted by Photonics Media as part of the 2026 Integrated Photonics Summit. LIGENTEC is a European silicon nitride photonic integrated circuit foundry headquartered in Lausanne, Switzerland. Contact: [email protected] #PhotonicIntegratedCircuits #SiliconNitride #Photonics #LIGENTEC #PhotonicsMedia