Design for Cleaning in PCB Manufacturing - Tech 2 Tech

High-tech, high-value cleaning answers made easy. In this session, Dr. Adam Klett, KYZEN’s Director of Science, explains how to incorporate cleanability early in PCB design to avoid dendrites, corrosion, and costly rework caused by ionic residues and trapped flux. Dr. Adam begins by explaining why design for cleaning in PCB manufacturing is critical to reliability, cost, and long-term performance. He reviews key PCB design-for-cleaning guidelines, including standoff height, component geometry, placement and spacing, shadowing, vented components, trace routing, solder mask dams, and silkscreen keep-outs that improve fluid access and rinsing. Dr. Adam also discusses IPC cleanliness expectations, why “no-clean” flux does not mean “do not clean,” and how design choices directly impact cleaning process complexity, inspection, and failure risk. He concludes with practical FAQs on cost-effective design changes, validating cleaning for dense or miniaturized assemblies, and using objective test methods like SIR and IPC-based compatibility testing to ensure reliable, clean PCBs :11 Intro to KYZEN’s Tech2Tech series and Dr. Adam Klett :23 Design for Cleaning in PCB Manufacturing :47 Why cleaning is Critical for Reliability 2:21 Design Considerations for Cleanability 3:35 Standoff Height and Component Geometry 4:49 Component Placement and Spacing 6:16 Traces, Solder Mask, and Silkscreen 9:10 Vented Components 10:19 Example – Component Selection 11:39 Key Takeaways 13:30 FAQs 16:30 Outro FAQ: https://tinyurl.com/4b7acx3e Website: https://Kyzen.com Twitter: https://bit.ly/3Q0UpX6 LinkedIn: https://bit.ly/3RoMFPJ Speaker Bio:   / aklett   Subscribe to our YouTube: https://bit.ly/3TpxrMr #KYZENclean #Tech2Tech #PCBManufacturing #DrAdam