Physical Design Full Course: Floorplanning to Routing | VLSI Basics & Advanced

Master Physical Design from first principles to advanced hardening techniques in this complete VLSI flow walkthrough. This video covers every stage — Floorplanning, Power-Planning, Placement, Clock Tree Synthesis (CTS), Routing, ECO Planning, and 3D-ICs — giving you a single reference for both basics and advanced interview prep. What You Will Learn: Physical Design Basics: chip design overview, partitioning, design-for-conquer Design Planning: AoT vs DoT, flat vs hierarchical, top-down vs bottom-up, fully-abutted designs Data Inputs: tech files, RTL, timing constraints (.sdc), reference libraries, UPF/CPF power intent NAND Equivalent Calculations: area estimation, utilization factor, timing feasibility, power estimation Floorplanning: baseline layout, macro/PAD/analog placement, pad-limited vs logic-limited designs Power-Planning: power ring, via-stacking, IR drop trade-offs, multi-voltage & power gating Placement: wire-length optimization, cell resizing, cloning, buffering Clock Tree Synthesis: high-fanout clock distribution, skew minimization, clock gating Routing: global & detailed routing, topology optimization Physical Verification Signoff: DRC, LVS, ERC Advanced: Moore's Law limits, 3D-ICs / System-in-Package, die stacking advantages & challenges Common Interview Questions Covered: ❓ How do you achieve higher frequency in a given node? ❓ How do you estimate area before hardening a block? ❓ What trade-offs exist between cost, power, and performance (PPA)? ❓ AoT vs DoT — when do you choose which? ❓ What are the key challenges in 3D-IC die stacking? 🔔 Subscribe for more VLSI deep dives: interview concepts, STA, CDC, SVA & RTL design.#PhysicalDesign #VLSI #ASICDesign #Floorplanning #ClockTreeSynthesis #PnR #Semiconductor #VLSIIntraview #ChipDesign #3DIC