What's Actually Inside a Chiplet? AMD vs Intel Explained

You plug in a processor and it works as one chip. But inside? There are two — or four — separate pieces of silicon that were manufactured in completely different factories. This is Episode II of The Modular Machine. In this episode we break down the anatomy of a chiplet package from scratch: ▸ Die vs Package vs Chiplet — what they actually are and how they differ from each other ▸ AMD's approach — CCD + IOD, two dies, two different process nodes, one package ▸ Intel's approach — four tiles, four factories, one processor ▸ How dies talk to each other — bump arrays, why proximity means TB/s bandwidth AMD chose 2 dies. Intel chose 4 tiles. Neither is wrong. Both are chiplets. But the decisions behind each are very different. ━━━━━━━━━━━━━━━━━━━━━━ THE MODULAR MACHINE SERIES ━━━━━━━━━━━━━━━━━━━━━━ Episode I → Why Chips Can't Just Get Bigger Anymore Episode II → Chiplet Anatomy: AMD vs Intel ← YOU ARE HERE Episode III → UCIe & Silicon Interposer (coming soon) ━━━━━━━━━━━━━━━━━━━━━━ 00:00 Introduction 01:00 Die, Package & Chiplet — the basics 02:30 AMD Zen: CCD + IOD explained 04:00 Intel Core Ultra: 4 tiles, different factories 05:15 How dies communicate — bump arrays 06:15 Summary & what's next ━━━━━━━━━━━━━━━━━━━━━━ AMD or Intel? Which chiplet approach do you think is smarter? Drop your answer in the comments 👇 ━━━━━━━━━━━━━━━━━━━━━━ #Chiplet #AMD #Intel #SemiconductorEngineering #CPUDesign #HardwareEngineering #ZenArchitecture #CoreUltra #MooresLaw #AxiomTech #TheModularMachine