Not Just Chips: Enabling high volume data communication – solving the new challenges in PIC wafer...

Enabling high volume data communication – solving the new challenges in PIC wafer testing Tobias Gnausch JENOPTIK · Advanced Photonic Solutions Thanks to Photonic Integrated Circuits (PICs), optics is becoming the key to fast data communication. Although not entirely new, PICs are an important future technology. They are already being used to implement applications such as data transceivers, gene sequencing, blood analysis and LiDAR. PICs enable power and bandwidth savings, as well as the creation of micro-photonic devices, novel sensors, and more. They are produced in a wide variety of designs on wafers using classic lithography methods and with existing equipment from established semiconductor manufacturers. The wafers are manufactured in almost the same way as electronic components. Wafer testing poses its own unique challenge. Due to additional optical components to be tested, the test throughput rates have not yet been achieved as is the case with established IC function tests. Test solutions for optical components still have to be procured and integrated, too. A complex realignment of the optical interfaces of the test device in the submicron range is also required for each chip. These challenges are solved with Jenoptik´s UFO Probe® card. It now enables simultaneous electrical and optical testing of chips on wafers with only one single probe card. It can be easily integrated into the existing test infrastructure for electrical function testing – thus eliminating the need for expensive investments in stand-alone solutions. The technology of the probe card is designed for high throughputs and for use in high-volume production. It allows chip manufacturers or test houses to get feedback on the performance of each chip at an early stage of production (wafer-level) - for a higher yield.