AEMtec Imagefilm - "From Wafer to Packaging"

AEMtec GmbH – E2MS – From Wafer to Packaging High-end chip level technology services for advanced electronic microsystems. http://www.AEMtec.com Comprehensive Process Capabilities: Cleaning Electronic design Schematic capture Multiple alloys Multiple layer rigid Layouting on flex Blue foil application Blind and buried vias Design for test and verification Component library and 3D models Automated Wafer inspection Wafer map translation and creation Fully automated dicing up to 12” wafers Printing on 12” MEMS wafers Screen printing of flux on wafers Automated 3D paste inspection Balling @ 60µm Loop control New wafer map UV glue dispensing Optical glue dispensing Surface-mount device Flying probe testing Flying probe point definition Flying probe enhanced programming Placement of micro-optical components Wafer inspection and fully automated repair Stud bumping high speed with 22µm Au wire Wedge-wedge gold bonding and shape control Reflow under vacuum and low temperature alloys High accuracy placement of multi mirror MEMS arrays There are many more... Director: Robert Patz Camera & Edit: Johannes Plank Sounddesign: Jörg Brinkmann Music: Broke For Free