Heat transfer simulation of heat source with fins using Comsol
This tutorial shows a 3D heat transfer model of a computer chip (heat source) cooled by fins (heat sink). A stationary study with parametric sweep is used to check the effect of increasing fin length on the maximum temperature of the chip. 00:00 Intro 00:20 Geometry 04:41 Materials 06:35 Physics 11:05 Mesh 11:50 Solution 14:15 Results Please subscribe and feel free to leave a comment!
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