Discover: hybrid bonding | CEA-Leti

CEA-Leti offers state-of-the-art technology bricks to enable 3D high performance applications: computing, telecommunication, photonics, RF and heterogeneous technologies. From design to fabrication and electrical characterization, CEA-Leti offers various hybrid bonding solutions using full 300&200mm fabrication lines including Known Good Dies: 👉 Wafer-to-wafer and die-to-wafer bonding technologies 👉 Multi-layer hybrid bonding techniques with fine connection pitches ( below 1μm) to support various technologies with high bandwidth 👉 Merging bonding techniques and modules for next generation of ultra-fine die alignment ( below 200nm) #HybridBonding #3D #packaging ------ Thank you for watching! Whether you are a company looking for a technological advantage for your product or a student, recent graduate, or technology professional looking for your next exciting career opportunity, check out the links below! ------ 🔔 Before you go, subscribe to our channel: http://bit.ly/suscribe-CEALeti ⏩ Follow us on LinkedIn: Leti - / leti ⏩ Follow us on X: @CEA_Leti - https://twitter.com/cea_leti?lang=fr ⏩ CEA-Leti breakthroughs and more on our website: http://www.leti-cea.com/cea-tech/leti... ⏩ Relive Leti Innovation Days: http://www.leti-innovation-days.com/ 🔍 Learn more about CEA-Leti in this short video: http://bit.ly/CEALeti