Luceda Webinar | Design for Packaging: Using the PHIX ADK for LiDAR and Datacom

Design for packaging is an important concept in PIC design as it allows you to consider the rules and constraints for packaging from the outset. This is achieved with an Assembly Design Kit (ADK). This integrated approach ensures that circuits can be efficiently packaged after fabrication, eliminating costly mistakes. In this webinar, you will learn how to design PICs for packaging using the PHIX ADK for LiDAR and Datacom applications. PHIX will introduce you to the PHIX Characterization package, and Luceda will talk about the design for packaging using Luceda and the PHIX ADK. Speakers: Andrea Alippi - Product Manager at PHIX Photonics Assembly Craig Godbold - Application Engineer at Luceda Photonics Moderator: Chiara Alessandri - Product Marketing and Technical Sales Manager at Luceda Photonics