미래 반도체 기술의 핵심...하이브리드 본딩의 역할과 전망

The Core of Future Semiconductor Technology...The Role and Prospects of Hybrid Bonding ※ This broadcast was aired on Monday, May 20, 2024. 00:00 Intro 00:26 The Meaning of Hybrid Bonding 02:21 Why Hybrid Bonding? 06:08 The Scope of Hybrid Bonding 07:50 The Impact of Process Changes 09:06 Pros and Cons of Collaborative Models and the Current Technology Landscape 13:57 The Impact of Bumpless Technology 18:19 Outlook for Hybrid Bonding 19:06 Domestic Companies Preparing to Adopt Hybrid Bonding Technology #Semiconductor #HBM4 #Foundry #Samsung Electronics #SK Hynix #Hybrid Bonding #Lee Se-cheol #Citigroup ----------------------------------------------------------------------------------------------------------------- ASSIC2024 Advanced Space Semiconductor Innovation Conference (Free) : Thursday, May 30, 2024, 09:00 - 17:00, Gyeonggi Economic and Science Accelerator Center, 1st Floor Gwanggyo Hall (https://yelec.kr/product/assic2024/) [Offline Event Overview] Event Name: 『Advanced Space Semiconductor Innovation Conference (ASSIC) 2024』 Date: Thursday, May 30, 2024, 9:00 AM - 5:00 PM Venue: Gwanggyo Hall, 1st Floor, Gyeonggi Economic and Science Promotion Agency (Gwanggyo Techno Valley) Capacity: 200 Attendees: Executives and staff from the public, private, industrial, academic, and research sectors related to space semiconductors Participation Fee: Free Hosted by: The Elec / QRT Organized by: YELEC / Korea Semiconductor Research Association Sponsored by: Korea Semiconductor Industry Association / Korea Fabless Industry Association Event Inquiries: Director Kim Sang-soo of The Elec [email protected] 010 5278 5958 -------------------------------------------------------------------------------------------------- ※ Diellek Membership Membership Guide (   • 디일렉 유튜브 멤버십 개설했습니다.  ) Membership Sign-up (   / @theelec9812  ) ※ Diellek Membership Benefits [Quick View of Diellek Videos] Diellek live videos and content are all free, but live replays are available exclusively to membership members.