Nordson DAGE Hot bump pull test
Nordson DAGE have a patented method of bondtesting solder pad quality and solder wetting in electronic devices. Our patented Hot Bump Pull (HBP) technology allows bondtested in a tensile mode on PCB assemblies. As our HBP cartridge is standalone, it can quickly be added to your 4000PLUS to complement any shear or wire pull testing in a quality control programme. To find out more please visit: https://www.nordson.com/en/divisions/...
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