삼성은 뜯고 화웨이는 접었다 … 스마트폰 칩 전쟁의 정반대 해법 | 발열의 진짜 이유

Recently, news regarding smartphone chips has emerged from Samsung and Huawei moving in completely opposite directions. Samsung is widening the path for heat to escape by moving memory, which was previously mounted on top of the chip, to the side. Conversely, Huawei has published a paper detailing a new design that folds and stacks the circuits inside the chip vertically. In this video, we examine why the two companies are moving in opposite directions and the shared concerns that serve as their starting point. We have broken down the structure of heat generation step by step, starting with why smartphones get hot and slow after prolonged use. We have summarized the Exynos 2400's fan-out packaging, the 2600's heat pass block, and the rumors surrounding the 2700. We have also covered where Apple and Qualcomm currently stand and the trends that have unfolded so far. We have distinguished what Huawei's logic folding and hybrid bonding actually change from what is exaggerated. We have tried to present confirmed facts, corporate claims, and unverified rumors as clearly as possible. Ultimately, the message is that a good mobile chip is not perfected simply by making transistors smaller. Written by Patch Edited by Lee Jin-i [email protected]