Webinar: Next-Generation Solderless RF Board-to-Board Interconnect Solutions from Radiall

Next-Generation Solderless RF Board-to-Board Interconnect Solutions Watch the recorded technical webinar from Wexøe Industry and Radiall and discover how next-generation solderless RF interconnect technology supports advanced radar, beamforming and SATCOM systems up to 40 GHz. In this webinar, we explore: ✔ High-density RF integration ✔ Ultra-low insertion loss ✔ Reduced assembly complexity ✔ Improved signal integrity and phase stability ✔ Lower total system cost The webinar is highly relevant for RF Engineers, Microwave Engineers, Hardware Designers and System Architects working within defence, aerospace, radar and advanced communication systems. #RFEngineering #Beamforming #RadarSystems #SATCOM #DefenceTechnology #RFInterconnect #MicrowaveEngineering #Aerospace