Lightmatter InterConnect Launch Event at OFC 2025

The future of AI data centers is here, and it's powered by light! This video unveils groundbreaking interconnect technologies set to revolutionize high-performance computing. We dive into the limitations of traditional copper interconnects in today's massive AI systems, showcasing how they create bottlenecks for scale-up and hinder the performance of powerful processors like GPUs from Nvidia and AMD. Lightmatter introduces two cutting-edge solutions: the L200 and the Passage M series. The L200 leverages 3D CPO (co-packaged optics) to bring the photonic engine directly alongside advanced node chips, dramatically increasing bandwidth and energy efficiency. See how this technology, developed in partnership with Alphawave Semi, shatters interconnect bottlenecks. For the ultimate in optical interconnect, the Passage M series, featuring an advanced interposer, enables chip-on-wafer integration and optical circuit switching. We explore the massive bandwidth capabilities of this solution, showcasing its potential for petabit-scale switching and its ability to handle the demands of AI workloads. Discover how this technology is paving the way for faster training of AI models and the next generation of scale-out supercomputers. This video also highlights the critical role of silicon photonics and WDM (wavelength division multiplexing) in achieving these advancements and acknowledges the contributions of industry partners like GlobalFoundaries, Amkor Technologies, and ASE Global in bringing these innovations to reality.